TED Member States· European UniontenderRequest by · 02 Dec 2026
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Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Fraunhofer-Gesellschaft, Einkauf B12
Requests to participate by 02 Dec 2026Requests to participate by02 Dec 2026
CPV category31712000
Published30 Oct 2026
Reference756518-2026
Notice summary
PR1275392-3460-W Automated 300 mm Die-to-Wafer thermocompression bonding tool
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